Unique new packaging of semiconductor packaging technology high performation by encapsulation epoxy resin and VPES (vacuum printing encapsulation systems)

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 245-251

  Okuno, A ^a  

^a Sanyu Rec Co Ltd   (Japan)

Author keywords

Encapsulation; Epoxy resins; Printing; Semiconductor device packaging; Vacuum systems; Vacuum technology

Indexed keywords

EID: 24644456497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298733     Document Type: Conference Paper

References (0)