3D SoP integration of A BAN sensor node

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1602-1606

  Brebels, Steven ^a   Sanders, Steven ^a   Winters, Christophe ^a   Webers, Tomas ^a   Vaesen, Kristof ^a   Carchon, Geert ^a   Gyselinckx, Bert ^a   De Raedt, Walter ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; BIOELECTRIC PHENOMENA; COST EFFECTIVENESS; DIPOLE ANTENNAS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; QUALITY ASSURANCE; RADIO WAVES;

BIOELECTRONICS COMMUNICATION SYSTEM; INTEGRATED ANTENNA; MICROCONTROLLER; SENSOR NODES;

WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 24644433505     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Stoukatch, S. et al, "High density 3D stack structure for SiP solutions", Proc. 14th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, 2003, pp. 341-343.
2. Stuchly, M. A. and Stuchly, S. S., "Dielectric Properties of Biological Substances - Tabulated", Journal of Microwave Power, Vol 15, No. 1 (1980), pp. 19-26.
3. Brebels, S. et al, "SoP Integration and Codesign of Antennas," IEEE Trans-CPMT-B on Advanced Packaging, Vol. 27, No. 2 (2004), pp. 341-351.