3D interconnection and packaging: Impending reality or still a dream?

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 47, Issue , 2003, Pages 100-101+471

  Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC DEVICES; ELECTRIC POWER SYSTEM INTERCONNECTION; HETEROJUNCTION BIPOLAR TRANSISTORS; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; VLSI CIRCUITS; WSI CIRCUITS;

3D INTERCONNECTION AND PACKAGING; ELECTRONIC SYSTEM; POWER CONSUMPTION; SYSTEM DESIGNERS;

ELECTRONICS PACKAGING;

EID: 2442691737     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)