Specific adhesion model for bonding hot-melt polyamides to vinyl

International Journal of Adhesion and Adhesives

Volumn 24, Issue 5, 2004, Pages 415-422

  Frihart, Charles R ^a  

^a FOREST PRODUCTS LABORATORY   (United States)

Author keywords

Acid base; Adhesion; Adhesive; Hot melt; Hydrogen bond; Model; Piperazine; Poly(ester amide); Polyamide; Polyvinyl chloride; Rheology; Solubility parameter

Indexed keywords

DIMERS; HOT MELT ADHESIVES; HYDROGEN BONDS; ORGANIC ACIDS; POLYAMIDES; POLYESTERS; POLYVINYL CHLORIDES; RHEOLOGY;

ACID-BASE; POLY(ESTER-AMIDE); SOLUBILITY PARAMETERS;

ADHESION;

ADHESION; ADHESIVES; DIMERS; HOT MELTS; HYDROGEN BONDS; ORGANIC ACIDS; POLYAMIDES; POLYVINYL CHLORIDE;

EID: 2442654353     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2003.11.008     Document Type: Article

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