Adhesion between photosensitive epoxy and electroless copper

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 248-252

  Ge, J ^a   Tuominen, R ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Adhesives; Chemicals; Copper; Etching; Polymers; Rough surfaces; Surface morphology; Surface roughness; Surface treatment; Testing

Indexed keywords

ADHESION; ADHESIVES; CHEMICALS; COATINGS; COPPER; ETCHING; JOINING; LIGHT SENSITIVE MATERIALS; MANUFACTURE; MORPHOLOGY; PHOTOSENSITIVITY; PLASTIC COATINGS; POLYMERS; SURFACE MORPHOLOGY; SURFACE PROPERTIES; SURFACE ROUGHNESS; TESTING;

BULK PROPERTIES; CHEMICAL TREATMENTS; ELECTROLESS COPPER; ETCHING PROCESS; PHOTOSENSITIVE EPOXY; PLATING PROCESS; POLYMER SURFACES; ROUGH SURFACES;

SURFACE TREATMENT;

EID: 2442622915     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860612     Document Type: Conference Paper

References (4)

1. A.Kujala, R.Tuominen and J.K.Kivilahti, "Solderless interconnection and packaging technique for active components", IEEE Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th, 1999, pp. 155-159.
2. Matienzo, L.J, Egitto, F.D, "Adhesion issues in electronic packaging", Solid State Technology, Jul95, Vol.38 Issue 7, pp. 99-105.
3. Georges Fourche, "An Overview of the Basic Aspects of Polymer Adhesion. Part 1: Fundamentals", Polymer Engineering and science, June 1995, Vol.35, No.12, pp. 957-967.
4. B. R. Karas, D. F. Foust, W. V. Dumas, and E. J. Lamby, Metallized Plastics 2, K, L. Mittal, ed., Plenum press, New York (1991).