Influence of nanosilica on composite underfill properties in flip chip packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 253-259

  Sun, Yangyang ^a   Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Electronic packaging; Flip chip; Nanocomposite; No flow; Silica; Underfill

Indexed keywords

ADHESIVES; BENDING STRENGTH; CHIP SCALE PACKAGES; DIELECTRIC PROPERTIES; MECHANICAL PROPERTIES; OPTICAL PROPERTIES; POLYMERS; RHEOLOGY; SILICA; SOLDERING; VISCOSITY; WATER ABSORPTION;

ELECTRONIC PACKAGING; FLIP CHIP; NANOCOMPOSITE; NO-FLOW; UNDERFILL;

FLIP CHIP DEVICES;

EID: 2442549740     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Wong, C.P., Luo, S., Zhang, Z., "Flip the Chip", Science, Vol. 290 (2000), pp. 2269-2279
2. Konsowski, S.G., Helland, A.R., Electronics Packaging of High Speed Circuitry, McGraw-Hill (New York, 1997), Chapter3
3. Wong, C.P. and Shi, S.H., U.S. Patent 6,180,696 (Jan. 30, 2001).
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6. ASTM Standard D792-91
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9. Struik,L.C.E., Failure of Plastics, edited Brostow, W. and Corneliussen, R.D., Hanser-SPE (Munich-Vienna-New York 1986)Chapter11
10. Myslinski, P., Lazowski, Z., "The effect of silica surface modification on the dielectric properties of silica-filled epoxy compounds", Mater. Chem. Phy. Vol. 33, No. 1-2 (1993) pp. 139-144