Reducing shrinkage and warpage for printer parts by injection molding simulation analysis

Journal of Injection Molding Technology

Volumn 6, Issue 3, 2002, Pages 177-186

  Ni, Shijun ^a  

^a LEXMARK INTERNATIONAL INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK TEMPERATURE; INJECTION PRESSURE; MOLD FILLING; SIMULATION SOFTWARE;

COMPUTER SIMULATION; COMPUTER SOFTWARE; OPTIMIZATION; PRINTERS (COMPUTER); THERMAL EFFECTS;

INJECTION MOLDING;

EID: 2442474809     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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