Mixed convection in rectangular cavities at various aspect ratios with moving isothermal sidewalls and constant flux heat source on the bottom wall

International Journal of Thermal Sciences

Volumn 43, Issue 5, 2004, Pages 465-475

  Guo, Guanghong ^a   Sharif, Muhammad A R ^a  

^a Box 870280   (United States)

Author keywords

Aspect ratio; Electronic circuit board cooling; Mixed convection; Numerical heat transfer; Rectangular enclosure

Indexed keywords

ASPECT RATIO; BOUNDARY CONDITIONS; CAVITATION; COMPUTATIONAL METHODS; COOLING; HEAT FLUX; ISOTHERMS; LINEAR ALGEBRA; NUSSELT NUMBER;

ELECTRONIC CIRCUIT BOARD COOLING; ISOTHERMAL SIDEWALLS; NUMERICAL HEAT TRANSFER; RECTANGULAR ENCLOSURES;

MIXED CONVECTION;

EID: 2442464838     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2003.08.008     Document Type: Article

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