Thermal compensation for a chirp fiber Bragg grating bonded substrate

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 1, 2004, Pages 188-193

  Chang, Y M ^a   Cheng, Chih Chun ^a   Lo, Yu Lung ^b  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Bimetallic beam configuration; Chirp fiber bragg grating (CFBG); FBG bonded; Prismatic; Substrate; Thermal

Indexed keywords

GEOMETRY; INVERSE PROBLEMS; OPTIMIZATION; REFRACTIVE INDEX; SUBSTRATES; THERMOSTATS;

BIMETALLIC BEAM CONFIGURATION; CHIRP FIBER BRAGG GRATING; SHAPE OPTIMIZATION; THERMAL COMPENSATION;

FIBER BRAGG GRATINGS;

EID: 2442443056     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.825374     Document Type: Article

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