Bending strain effect on critical current of Bi-2223 superconductor tapes-report of international round-robin-test

Physica C: Superconductivity and its Applications

Volumn 425, Issue 3-4, 2005, Pages 111-120

  Kuroda, T ^a   Itoh, K ^a   Katagiri, K ^b   Goldacker, W ^c   Haessler, W ^d   Haken, B Ten ^e   Kiuchi, M ^f   Noto, K ^g   Ochiai, S ^h   Otabe, S ⁱ   Shin, H S ^j   Sosnowski, J ^k   Weijers, H ^l   Wada, H ^m   Kumakura, K ^a  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b IWATE UNIVERSITY   (Japan)

^c KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^d IFW DRESDEN   (Germany)

^e UNIVERSITY OF TWENTE   (Netherlands)

^f KYUSHU UNIVERSITY   (Japan)

^g Iwate Industrial Promotion Center   (Japan)

^h KYOTO UNIVERSITY   (Japan)

ⁱ KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

^j Andong National University   (South Korea)

^k ELECTROTECHNICAL INSTITUTE   (Poland)

^l FLORIDA STATE UNIVERSITY   (United States)

^m UNIVERSITY OF TOKYO   (Japan)

more..

Author keywords

Bending strain; Bi 2223 Ag tape; Critical current; Measurement method; Round robin test

Indexed keywords

BENDING (DEFORMATION); BISMUTH ALLOYS; CRITICAL CURRENTS; STRAIN RATE;

BENDING STRAIN; BI 2223/AG TAPE; MEASUREMENT METHOD; ROUND-ROBIN-TEST;

SUPERCONDUCTING TAPES;

EID: 24344467537     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physc.2005.06.018     Document Type: Article

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