Mechanical and electrical properties of Ti2SnC dispersion-strengthened copper

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 96, Issue 8, 2005, Pages 847-852

  Wu, Jinyi ^a   Zhou, Yanchun ^a,b   Yan, Chengke ^a  

^a INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Cu; Electrical resistivity; Mechanical properties; Ti2SnC

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; GRAIN SIZE AND SHAPE; HOT PRESSING; MECHANICAL PROPERTIES; MICROSTRUCTURE; TITANIUM COMPOUNDS; VOLUME FRACTION; YIELD STRESS;

DISPERSION-STRENGTHENED (DS) COPPER MATRIX; ELECTRICAL RESISTIVITY; STRENGTHENING EFFECT; TI2SNC;

COPPER;

EID: 24344445323     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101111     Document Type: Article

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