STEM role in failure analysis

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1526-1531

  Iannello, M A ^a   Tsung, L ^b  

^a TEXAS INSTRUMENTS   (France)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; IMAGE ANALYSIS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; X RAY ANALYSIS;

HIGH RESOLUTION IMAGES; X-RAY DETECTORS;

FAILURE ANALYSIS;

EID: 24144499954     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.059     Document Type: Conference Paper

References (3)

1. Krumeich F. www.microscopy.ethz.ch/STEM.htm.
2. " Scanning Transmission Electron Microscopy (STEM) for SEM and Dual Beam™ (SEM/FIB), Application note, FEI Company.
3. "STEM technique in the XLFEG series, Patent applied for M.F. Hayles & G. Veen, author Mike Hayles.