SCOPUS 정보 검색 플랫폼

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1786-1789

Failure analysis of micro-heating elements suspended on thin membranes

(6) Briand, D a Beaudoin, F b Courbat, J a De Rooij, N F a Desplats, R b Perdu, P b

a UNIVERSITY OF NEUCHÂTEL (Switzerland)

b CNES (France)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DEGRADATION; DIELECTRIC MATERIALS; FAILURE ANALYSIS; HIGH TEMPERATURE EFFECTS; MICROELECTRONICS; PLATINUM; RELIABILITY; SCANNING ELECTRON MICROSCOPY; STRESSES; THERMOCOUPLES; THIN FILMS;

DIELECTRIC MEMBRANES; MECHANICAL DEFORMATION; MICRO-HEATING ELEMENTS; THIN MEMBRANES;

ELECTRIC HEATING ELEMENTS;

EID: 24144458658 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/j.microrel.2005.07.106 Document Type: Conference Paper

Times cited : (22)

References (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.