Shape evolution of high density interconnection bumps used for microprocessor

Kagaku Kogaku Ronbunshu

Volumn 22, Issue 3, 1996, Pages 539-541

  Konodo, Kazuo ^a   Shinohara, Kunio ^a   Fukui, Keisuke ^b  

^a HOKKAIDO UNIVERSITY   (Japan)

^b UNIVERSITY OF HYOGO   (Japan)

Author keywords

Bumps; High Density Interconnection; Microprocessor; Numerical Fluid Dynamics; Pattern Electordeposition; Shape Evolution

Indexed keywords

CATHODES; ELECTRODES; MASS TRANSFER; REYNOLDS NUMBER;

BULK SOLUTIONS; BUMP FORMATION; BUMPS; HIGH-DENSITY INTERCONNECTION; MICROSCOPIC FLOW; PATTERN ELECTORDEPOSITION; PENETRATION FLOWS; SHAPE EVOLUTION;

MICROPROCESSOR CHIPS;

EID: 24044512424     PISSN: 0386216X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Alkire, R. and H. Deligianni,: "The Role of Mass Transfer on Anisotropic Electrochemical Pattern Etching", The Journal of Electrochem. Soc., 135, 1093-1100 (1988)
2. Alkire, R., D. Reiser, and R. Sani,: "Effect of Fluid Flow on Removal of Dissolution Products from Small Cavities", ibid, 131, 2795-2800 (1984)
3. 2 Solutions", ibid, 140, 1340-1347 (1993)