Computer simulation of the effect of Thermal Contact Resistance on cooling time in injection molding

Simulation

Volumn 73, Issue 3, 1999, Pages 144-148

  Sridhar, L ^a   Narh, K A ^a,b  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

^b ASME   (United States)

Author keywords

Heat transfer; Injection molding; TCR; Thermal contact resistance

Indexed keywords

EID: 24044480692     PISSN: 00375497     EISSN: None     Source Type: Journal    
DOI: 10.1177/003754979907300301     Document Type: Article

References (6)

1. Chiang, H.H., Himasekhar, K., Santhanam, N. and Wang, K.K. "Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage." Journal of Eng. Material Tech., Vol. 115, pp 37-47, 1993.
2. C-MOLD Users Manual, AC Technology, Ithaca, NY, 1997.
3. Yu, C.J., Sunderland, J.E., and Poli, C. "Thermal Contact Resistance in Injection Molding." Polymer Engineering Science, Vol. 30, pp 1599-1605, 1990.
4. Wang, H., Prystay, M., Hétu, J.-F., Cao, B., and Jen, C.K. "Gap Between Mold and Part and its Effect on Cooling of Injection-Molded Plastics." Society of Plastics Engineers - ANTEC Tech. Papers, Indianapolis, IN, Vol. 1, pp 1049-1053, 1996.
5. Sridhar, L. and Narh, K.A. "An Inverse Method for the Determination of Thermal Conductivity and Thermal Contact Resistance - Simulated Results." Proceedings of the 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, Vol. 3, pp 267-273, 1998.
6. Narh, K.A. and Sridhar, L. "Measurement and Modeling of Thermal Contact Resistance at a Plastic Metal Interface." Society of Plastics Engineers - ANTEC Tech. Papers, Vol. 43, pp 2273-2277, 1997.