Hybrid CMP process for copper and ultra low-k materials integration

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 113-119

  Nguyen, Viet H ^a   Daamen, Roel ^a   Van der Velden, Peter ^b   Weimar, Frauke ^c   Smekalin, Konstantin ^d  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b Rodel Europe GmbH   (Germany)

^c 3M Deutschland GmbH   (Germany)

^d APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; EROSION; PHASE TRANSITIONS; POLISHING; SLURRY PIPELINES; WSI CIRCUITS;

FIXED ABRASIVE POLISHING PAD (FACMP); INTERCONNECT STACK INTEGRITY; LOW-K MATERIALS; RATE INFLUENCES;

COPPER;

EID: 23844556500     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th International Symposium on Chemical Mechanical Polishing, Lake Placid NY August (2001)
2. Ross E. Barker, Glenn C. Mandigo, Craig D. Lack, Proceedings CMP-MIC 2001, p. 144 (2001)
3. L. Peters, Semiconductor international, p. 56, November (1999)