On short-time-scale stress wave phenomena and initiation of mechanical faults in flip-chip configurations

IEEE Transactions on Device and Materials Reliability

Volumn 5, Issue 2, 2005, Pages 224-230

  Nagaraj, Mahavir ^a,b   Steve Suh, C ^a  

^a Department of Electrical and Computer Engineering   (United States)

^b LYNNTECH INC   (United States)

Author keywords

Device reliability; Flip chip; Short time scale effects; Wave propagation

Indexed keywords

DEVICE RELIABILITY; FLIP-CHIP CONFIGURATIONS; MECHANICAL FAULTS; SHORT-TIME-SCALE EFFECTS;

ELECTRIC FAULT CURRENTS; ELECTRONICS INDUSTRY; MICROCRACKS; MICROELECTRONICS; SEMICONDUCTOR JUNCTIONS; STRESS ANALYSIS; THERMAL EXPANSION; WAVE PROPAGATION;

FLIP CHIP DEVICES;

EID: 23844556226     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2005.846828     Document Type: Conference Paper

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