Crack-free, thick rhodium deposition on copper substrate using Rhodex solution

Journal of Radioanalytical and Nuclear Chemistry

Volumn 265, Issue 3, 2005, Pages 455-458

  Sadeghi, M ^a,b   Afarideh, H ^b   Aardaneh, K ^a   Kiyomarsi, M ^a   Mirzaii, M ^a  

^a Nuclear Research Center for Agriculture and Medicine NRCAM   (Iran)

^b AMIRKABIR UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; PALLADIUM; RHODIUM;

ARTICLE; DIRECT CURRENT; DRY DEPOSITION; ELECTROCHEMISTRY; PHYSICAL CHEMISTRY; TEMPERATURE DEPENDENCE;

EID: 23844545928     PISSN: 02365731     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10967-005-0848-9     Document Type: Article

References (17)

1. A. HERMANNE, M. SONCK, A. FENYVESI, L. DARABAN, Nucl. Inst. Meth. Phys. Res., B170 (2000) 281.
2. R. PINNER, Electroplating, August, (1953) 276.
3. A. M. WEISBERG, Mater. Meth., 4 (1953) 292.
4. F. H. REID, Met. Rev., 8 (1963) 167.
5. Backe & Co. Inc., U. S. Patent 1,981,820.
6. http://www.enthone-omi.com/fdc/proddetail.cfm
7. M. L. DAS, Metal Finish., 92 (1994) 2.
8. R. PIOTELLI, Chimica Industr., 21 (1939) 478.
9. W. S. MLU, Y. S. FUNG, Plating Surface Finish., March, (1986) 58.
10. A. BRENNER, W. A. OLSON, Proc. Am. Electroplat Soc., 53 (1946) 29.
11. M. O. KOSTIN, Mater. Sci., 33 (1997) 212.
12. F. H. REID, Metal Finish., 35 (1959) 74.
13. J. HILL, Metal Revs., 15 (1964) 55.
14. V. W. SIGLE, T. KORAS, Galvanotechnik, D-88348, 89 (1998) 2191.
15. W. D. BOX, in: ORNL-3802, UC-23-Isotopes-Industrial Technology, TID-450.39, 1964, p. 29.
16. M. C. LAGUNAS-SOLAR, M. J. AVILA, P. C. JOHNSON, Intern. J. Appl. Radiation Isotopes, 38 (1987) 151.
17. M. RAMLI, H. L. SHARMA, Intern. J. Appl. Radiation Isotopes, 48 (1997) 327.