Electrical and microstructural characterization of narrow Cu interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 225-229

  Wu, W ^a,b   Brongersma, S H ^a   Vervoort, I ^a   Bender, H ^a   Van Hove, M ^a   Maex, K ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

MAYADAS-SHATZKES MODEL; MOORE'S LAW; NARROW INTERCONNECT LINES; NARROW LINES;

OPTICAL INTERCONNECTS;

EID: 23844544691     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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