The influence of microstructure on thermal conductivity of SiC liquid-phase-sintered with BeO addition

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 54, Issue 6, 2005, Pages 559-562

  Nakano, Hiromi ^a   Watari, Koji ^b   Ishizaki, Kozo ^c   Urabe, Kazuyori ^d  

^a RYUKOKU UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^d NONE

Author keywords

Grain boundaries; Liquid phase sintering; Microstructure; Silicon carbide; Thermal conductivity; Transmission electron microscopy

Indexed keywords

BERYLLIUM COMPOUNDS; CERAMIC MATERIALS; GRAIN BOUNDARIES; IMAGE ANALYSIS; IMPURITIES; PRECIPITATION (CHEMICAL); SILICON CARBIDE; SINTERING; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

BEO; LIQUID PHASE SINTERING; NON-OXIDE CERAMICS; SIC CERAMICS;

MICROSTRUCTURE;

EID: 23844541143     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.54.559     Document Type: Article

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