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Volumn 404, Issue 1-2, 2005, Pages 26-32
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Numerical simulations of crack formation from pegs in thermal barrier systems with NiCoCrAlY bond coats
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Author keywords
Interfacial fracture; Pegging phenomenon; Thermal barrier coatings; Thermal cycling
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Indexed keywords
COMPUTER SIMULATION;
CRACK INITIATION;
FRACTURE MECHANICS;
GROWTH (MATERIALS);
HIGH TEMPERATURE EFFECTS;
NICKEL ALLOYS;
OXIDES;
SHEAR STRESS;
STRAIN;
SWELLING;
THERMAL CYCLING;
THERMAL EXPANSION;
BOND COATS;
INTERFACIAL FRACTURE;
PEGGING PHENOMENON;
THERMALLY GROWN OXIDE;
THERMAL BARRIER COATINGS;
SUPERCONDUCTOR;
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EID: 23844538590
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.05.033 Document Type: Article |
Times cited : (43)
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References (25)
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