Dual damascene formation technique using Nano-Clustering Silica (NCS) for 65nm node interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 97-102

  Iba, Y ^a   Misawa, N ^a   Sugiura, I ^a   Nishikawa, N ^a   Sugimoto, F ^a   Setta, Y ^a   Kitada, H ^a   Koura, Y ^a   Nakata, Y ^a   Nakahira, J ^a   Nakano, K ^a   Hasegawa, A ^a   Nakaishi, M ^a   Shimizu, N ^a   Fukuyama, S ^a   Nakai, S ^a   Nakamura, T ^a   Yano, E ^a   Miyajima, M ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ETCHING; MASKS; NANOSTRUCTURED MATERIALS; OPTICAL INTERCONNECTS; POROUS MATERIALS;

ASHING DAMAGE; DAMASCENE FORMATION; NANO-CLUSTERING SILICA (NCS); NODE INTERCONNECTS;

SILICA;

EID: 23844464857     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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6. J. Nakahira, et al., Proc. Advanced Metallization Conf. 2003, 477 (2004)
7. T. Nakamura, et al., Proc. IITC 2004, 175 (2004)