The ashing damage study of porous Low-k material for Cu damascene structure

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 369-374

  Inoue, O ^a   Jimbo, T ^a   Katsuyama, K ^a   Tamaru, T ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DRY ETCHING; ELASTIC MODULI; HARDNESS; INDENTATION; MIXTURES; PERMITTIVITY; POROUS MATERIALS; SILICA;

DAMASCENE STRUCTURE; NANO-CLUSTERING SILICA (NCS); PLASMA ASHING; X-RAY REFLECTOMETRY;

DIELECTRIC MATERIALS;

EID: 23844453065     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. N. Ohashi et al., ADMETA, p. 8 (2003)
2. M. Ikeda et al., Proc. of IITC, p. 71 (2003)
3. A. Matsushita et al., Proc. of IITC, p. 147 (2003)
4. T. Jacobs et al., Proc. of IITC, p. 236 (2002)