New laser marking technology using ultra-fast lasers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5713, Issue , 2005, Pages 132-136

  Gu, Bo ^a  

^a GSI Lumonics Inc   (United States)

Author keywords

Laser marking; Micro marks; Nano marks; Thin silicon wafers; Ultrafast laser; Zero kerf height

Indexed keywords

CONSUMER ELECTRONICS; INDUSTRIAL APPLICATIONS; LASER APPLICATIONS; LASER BEAM EFFECTS; NEODYMIUM LASERS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

LASER MARKING; MICROMARKS; NANO MARKS; THIN SILICON WAFER; ULLTRAFAST LASER; ZERO KERF HEIGHT;

ULTRAFAST PHENOMENA;

EID: 23744516740     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.591648     Document Type: Conference Paper

References (2)

1. D. Brandenburg, " Die level wafer marking", SEMICON West 2002, SEMI International Standard STEP Programs, July 22, 2002, San Francisco,CA.
2. Bo Gu, et.al., " Laser wafer marking at die level", IMAPS 2003, November 19, Boston, MA.