Link measurements to nonlinear bipolar device modeling

Microwaves and RF

Volumn 35, Issue 2, 1996, Pages 114-130

  Dunn, Mark ^a   Schaefer, Bob ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 23444455024     PISSN: 07452993     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. A. Smith, J. Fraser, and J. O'Neil, "Measurement and Prediction of Operating Temperature for GaAs ICs," IEEE SEMI-THERM Symposium Proceedings, December 1986, Paper A.5.
2. W.B. Joyce, Solid State Electronics, Vol. 18, 1975, p. 321.
3. H.S. Carslow and J.C. Jaeger, Conduction of Heat in Solids, Oxford University Press, Oxford, 1939.
4. G.E. Myers, Analytic Methods in Conduction Heat Transfer, McGraw-Hill, New York, 1971.
5. P.R. Strickland, "The Thermal Equivalent Circuit of a Transistor," IBM Journal, January 1939.
6. J. Meyer, D. Root, and K. Poulton, "Dynamic Thermal Modeling of Active Devices in Circuits, MTT Thermal Workshop, June 1993.