Adhesion characteristics of plasma-surface-treated carbon fiber-epoxy composite with respect to release films used during demolding

Journal of Adhesion Science and Technology

Volumn 18, Issue 4, 2004, Pages 473-494

  Kim, Jin Kook ^a   Lee, Dai Gil ^b  

^a LG Electronics Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesive joint; AFM; Atmospheric pressure plasma; Carbon fiber epoxy composite; Contact angle; Dielectric barrier discharge; Release film; SEM; Surface free energy; Surface treatment; XPS

Indexed keywords

ADHESIVE JOINTS; ATMOSPHERIC PRESSURE; ATOMIC FORCE MICROSCOPY; CARBON FIBERS; CHEMICAL BONDS; COMPOSITE MATERIALS; CONTACT ANGLE; FREE ENERGY; METAL MOLDING; PLASMA ACCELERATORS; POLYPROPYLENES; SCANNING ELECTRON MICROSCOPY; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY; ADHESION; BOND STRENGTH (MATERIALS); COMPOSITE FILMS; DIELECTRIC DEVICES; PLASMA APPLICATIONS; PLASMA SOURCES; POLYAMIDES; RAYON;

ATMOSPHERIC PRESSURE PLASMA; CARBON FIBER-EPOXY COMPOSITES; DIELECTRIC BARRIER DISCHARGE; RELEASE FILMS; SURFACE FREE ENERGY;

ADHESION; CARBON FIBERS;

AFM; ATMOSPHERIC PRESSURE PLASMA; CARBON FIBER-EPOXY COMPOSITE; DIELECTRIC BARRIER DISCHARGES; RELEASE FILM; SURFACE FREE ENERGY;

EID: 2342652302     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104323016379     Document Type: Article

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