Carbon Nanotube Filled Conductive Adhesives

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 35-38

  Li, Jing ^a   Lumpp, Janet K ^a   Grulke, Eric ^b  

^a UNIVERSITY OF KENTUCKY   (United States)

^b UNIVERSITY OF KENTUCKY   (United States)

Author keywords

Carbon nanotube (CNT); Conductivity; Epoxy; Ultrasonic process

Indexed keywords

CONCENTRIC TUBES; CONDUCTIVE ADHESIVES; ULTRASONIC PROCESSES;

ADHESIVES; COMPOSITE MATERIALS; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; EPOXY RESINS; FILLERS; FULLERENES; LEAD; LOW TEMPERATURE EFFECTS; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS;

CARBON NANOTUBES;

EID: 2342627402     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Shinotani, K., Malmodin, J., Trankell, R., "Fundamentals of Microsystems Design for Environment", in Fundamentals of Microsystems Packaging, edited by Rao R. Tummala, McGraw Hill, New York, 2001