A novel integrated packaging technique for high density DC-DC converters providing enhanced efficiency and thermal management

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2004, Pages 1229-1235

  Wanes, John ^a  

^a Celestica Power Systems   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC LOADS; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT SINKS; PERFORMANCE; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES;

HIGH CURRENT LOADS; INTEGRATED PACKAGING TECHNIQUE; THERMAL MANAGEMENT;

ELECTRIC CONVERTERS;

EID: 2342620795     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2004.1295979     Document Type: Conference Paper

References (4)

1. Mahmoud P. Sayani, John Wanes, "Trends And Drivers In Isolated Board-Mounted DC/DC Products for Communications Applications", APEC 2003.
2. Canadian patent application No. 2394403
3. US patent application No. 10/278,778
4. "The International Technology Roadmap for Semiconductors" Semiconductor Industry Association, 2001 Edition.