Wafer Level Packaging Technology for Low-Loss On-chip Transmission Lines and Inductors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 167-172

  Carchon, G ^a   Sun, X ^a   De Raedt, W ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

Inductor; Integrated passives; Silicon; Thin film; Transmission line

Indexed keywords

BONDING; COMPUTER SIMULATION; COSTS; ELECTRIC INDUCTORS; ELECTRIC LINES; ELECTRONICS PACKAGING; METALLIZING; PASSIVATION; PHOTOLITHOGRAPHY; POLYSILICON; SILICON WAFERS; SUBSTRATES; THIN FILMS; WAVEGUIDES;

BACK-END OF LINE (BEOL); INTEGRATED PASSIVES; LINE PITCH; WAFER LEVEL PACKAGING (WLP);

MICROELECTRONICS;

EID: 2342619621     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. R. Groves, J. Malinowski, R. Volant, and D. Jadus, "High Q inductors in a SiGe BiCMOS process utilizing a thick metal process add-on module," presented at IEEE BCTM, Minneapolis, MN, pp. 149-152, Sept, 26-28, 1999.
2. G. Carchon and W. De Raedt, "Chapter 10: Integrated Inductors," in Integrated Passive Component Technology, L. Schaper and R. Ulrich, Eds., IEEE Press, July 2003.
3. S. Jenei, S. Decoutere, K. Maex, and B. Nauwelaers, "Add-on Cu/SILK Module for High Q inductors," IEEE Electron Device Letters, vol. 23, pp. 173-175, 2002.
4. J. W. M. Rogers, V. Levenets, C. A. Pawlowicz, N. G. Tarr, T. J. Smy, and C. Plett, "Post-processed inductors with application to a completely integrated 2 GHz VCO," IEEE Transactions on Electron Devices, vol. 48, pp. 1284-1287, 2001.
5. X. Huo, K. J. Chen, and P. C. H. Chan, "Silicon-based high-Q inductors incorporating electroplated copper and low-K BCB dielectric," IEEE Electron Device Letters, vol. 23, pp. 520-522, 2002.
6. G. Carchon, W. De Raedt, and E. Beyne, "High-Q inductors on low resistivity silicon through wafer post-processing," presented at IMAPS, Denver, CO, pp. 604-609, September, 4-6, 2002.
7. G. Carchon, P. Pieters, K. Vaesen, W. De Raedt, B. Nauwelaers, and E. Beyne, "Multi-layer thin film MCM-D for the integration of high-performance wireless front-end systems," Microwave Journal, vol. 44, pp. 96-110, 2001.
8. G. Carchon, S. Brebels, O. Vendier, and W. De Raedt, "Multi-layer thin-film MCM-D for the realization of Q- and V-band functions," presented at IEEE MTT-S Digest, Philadelphia, PA, pp. 1151-1154, June, 8-13, 2003.
9. C. P. Yue and S. S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF IC's," IEEE Journal of Solid-State Circuits, vol. 33, pp. 743-752, 1998.
10. X. Sun, G. Carchon, W. De Raedt, and E. Beyne, "Analysis of high Q Inductors realized using Wafer-Level Packaging Techniques," presented at Electronic Components and Technology Conference, New Orleans, Louisiana, pp. 1510-1515, May, 27-30, 2003.