Thermal stability of 5083 Al synthesized by reactive atomization and deposition

Scripta Materialia

Volumn 51, Issue 1, 2004, Pages 71-76

  Lin, Yaojun ^a   Zhou, Yizhang ^a   Hayes, Robert W ^b   Lavernia, Enrique J ^a  

^a University of California Davis   (United States)

^b Metals Technology Inc   (United States)

Author keywords

Oxide dispersoid; Reactive atomization and deposition; Thermal stability

Indexed keywords

ANNEALING; ATOMIZATION; GRAIN BOUNDARIES; INERT GASES; MAGNESIUM COMPOUNDS; MICROHARDNESS; MICROMETERS; MICROSTRUCTURE; NUCLEATION; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; STRAIN HARDENING; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY; VICKERS HARDNESS TESTING;

BACKFILLING; N2 SPRAY DEPOSITION (SDN); OXIDE DISPERSOID; REACTIVE ATOMIZATION AND DEPOSITION;

ALUMINUM ALLOYS;

EID: 2342572357     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.03.009     Document Type: Article

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