Research on a micro-channel heat exchanging system based on thermoelectric control

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 225-230

  Jia, J Y ^a   Wang, W D ^a   Wang, H X ^a   Fan, K Q ^a  

^a XIDIAN UNIVERSITY   (China)

Author keywords

Best performance coefficient; High low temperature; Micro channel; Thermal management; Thermoelectric; heat exchanger

Indexed keywords

CONTROL EQUIPMENT; ELECTRONICS PACKAGING; HEAT TRANSFER; HYDRAULICS; KINEMATICS; NUSSELT NUMBER; PRANDTL NUMBER; PUMPS; SENSORS; THERMAL CONDUCTIVITY; THERMOELECTRICITY; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY;

BEST PERFORMANCE COEFFICIENTS; HIGH-LOW TEMPERATURE; MICRO-CHANNELS; THERMAL MANAGEMENT; THERMOELECTRIC;

HEAT EXCHANGERS;

EID: 2342512062     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Tuckermann D.B. and Pease R.F., "Optimized Convective Cooling Using Micromachined Structure", J. Electronchem. Soc., vol.129, p.C98, 1982.
2. Cuta J. M., Bennett W.D., et al, "Fabrication and Testing of Micro-Channel Heat Exchangers", SPIE Vol.2640, pp. 152-160.
3. Seraphim, et al., "Principles of Electronic packging", McGraw-Hill (New York, 1989), p. 154.
4. Simons R. E. and Chu R. C., "Application of Thermoelectric cooling to Electronic Equipment: A Review and Analysis", Proc. Of the Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium SEMI-THERM, pp. 1-9, San Jose, USA, 21-23 March 2000.
5. Liu J., "Micro/Nanometer scale Heat Transfer", Science Press(Peking, China, 2001.3).
6. Yang S.M an Tao W.S., "Heat Transfer Theory", Publishing House of Higher Education(Peking, China, 1998.12).
7. Qiu H.P., "Thermal Management Technology of Electronic Devices and Apparatus", Publishing House of Electronics Industry(Peking, China, 1991.3).
8. Dziurdzia P., A. Kos, "High Efficiency Active Cooling System", Proc. Of the Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium SEMI-THERM, pp. 19-26, San Jose, USA, 21-23 March 2000.
9. Xu D. S., "Thermoelectric Refrigeration and Its Applications", Publishing House of Jiao tong University of (Shanghai, China,1992.11).
10. Phillips R.J., "Micro-channel Heat Sinks", in Advance in Thermal Modeling of Electronic Components and Systems, Vol 2, ASME Press, New York, 1990.
11. Tso C. P. and Mahulikar S.P., "Laminar Convection Behaviour in Microchannels in Convection Thermal Entry Length and Beyond", Proc. of 10th IEEE/CMPT Electronics Packaging Technology Conference, pp. 126-132,1998.