Overview latest technologies using heat pipe and vapor chamber for cooling of high heat generation notebook computer

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 221-224

  Wuttijumnong, Vijit ^a   Nguyen, Thang ^a   Mochizuki, Masataka ^a   Mashiko, Koichi ^a   Saito, Yuji ^a   Nguyen, Tien ^a  

^a FUJIKURA LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COPPER; HEAT FLUX; HEAT LOSSES; HEAT PIPES; HEAT RESISTANCE; PUMPS; THERMAL CONDUCTIVITY;

CLOCK SPEED; NOTEBOOKS; POWER PROCESSORS; VAPOR CHAMBERS;

COOLING;

EID: 2342506420     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito and I. Sauciuc, "Advance Cooling System Using Miniature Heat Pipes In Mobile PC", Itherm '98, May 27-30, Seattle, WA, USA.