Characterization of airflow impedance in two types of telecommunications chassis

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 161-167

  Rhee, Jinny ^a   Wong, Gilbert ^a  

^a SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

Airflow impedance curve; High altitude forced convection cooling of electronics; Non dimensional parameters

Indexed keywords

AIRFLOW; IMPEDANCE CURVES; NETWORK EQUIPMENT AND BUILDING STANDARD (NEBS); NETWORK SAFETY;

AIR; BLOWERS; COOLING SYSTEMS; ELECTROMAGNETIC COMPATIBILITY; FANS; FLOW OF FLUIDS; HEAT CONVECTION; HEAT SINKS; HEAT TRANSFER; PRODUCT DESIGN; REYNOLDS NUMBER; TELECOMMUNICATION; TURBULENT FLOW;

ELECTRONIC EQUIPMENT;

EID: 2342472566     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Wong, H and Peck, R.E. "Experimental Investigation of Air-cooling Electronics at High altitudes," Journal of Electronics Packaging, v123, pp 356-365, December 2001
2. Rhee, J. and Azar, K., "Adjusting Temperature Data for High Altitude," Electronics Cooling Magazine, v5, n3 September 1999
3. Belady, C.L., "Design Considerations for Air Cooling Electronic Systems in High Altitude Conditions," IEEE Transactions on Components, Packaging and Manufacturing Technology, v19 n4, pp 495-500 December 1996
4. Holman, J.P., Heat Transfer, Sixth Edition, McGraw-Hill, 1986
5. White, E.B., Fluid Mechanics, Second Edition, McGraw-Hill, 1986
6. Sergent, J.E., and Krum, A., Thermal Management Handbook for Electronic Assemblies, pp 8.56-8.58 McGraw-Hill, New York, 1998
7. Moffat, R.J., "Contributions to the Theory of Single-Sample Uncertainty Analysis," ASME Journal of Fluids Engineering Vol 104 pp 250-260, 1982