Generalization of the ideal crack model in eddy-current testing

IEEE Transactions on Magnetics

Volumn 40, Issue 2 II, 2004, Pages 1366-1369

  Beltrame, Ph ^a,b   Burais, N ^a  

^a Univ Claude Bernard Lyon1   (France)

^b BRANDENBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Eddy current testing; Integral equations; Modelization; Thin crack

Indexed keywords

CRACKS; CURRENT DENSITY; ELECTRIC CONDUCTANCE; ELECTRIC FIELDS; ELECTRIC POTENTIAL; ELECTROMAGNETIC FIELDS; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; POISSON EQUATION; PROBLEM SOLVING;

ELECTRIC SCALAR VOLTAGE; MODELIZATION; THIN CRACKS;

EDDY CURRENT TESTING;

EID: 2342462384     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2004.825433     Document Type: Article

References (8)

1. J. Bowler, "Eddy-current interaction with an ideal crack. The forward problem," J. Appl. Phys., vol. 75, no. 12, pp. 8128-8137, 1994.
2. Ph. Beltrame and N. Burais, "Computing methods of hypersingular intergal applied to Eddy-Current Testing," IEEE Trans. Magn., vol. 38, pp. 1269-1272, Mar. 2002.
3. _, "Application of regularization method to compute eddy-current distribution near cracks," COMPEL, vol. 24, no. 4, 2002.
4. F. Villone and N. Harfield, "Simulation of the effects of current leakage across thin cracks," in Electromagnetic Nondestructive Evaluation (IV). Amsterdam, The Netherlands: IDS Press, 2000, pp. 79-86.
5. Ph. Beltrame, "Modélization de la Perturbation Électromagnétique au Voisinage D'une Fissure Mince. Application au Contrôle Non Destructif par Courants de Foucault," PhD thesis, Ecole Centrale, Lyon, France, 2002.
6. _, "Special elements at the crack edges in the eddy-current testing," presented at the ISEF Congr., Maribor, Slovenia, 2003.
7. J. Bowler et al., "Eddy-current probe impedance due to a volumetric flaw," J. Appl. Phys., vol. 70, no. 3, pp. 1107-1114, 1991.
8. Z. Badics et al., "An effective 3-D finite element scheme for computing electromagnetic field distortions due to defects in eddy-currents nondestructive evaluation," IEEE Trans. Magn., vol. 33, pp. 1012-1020, Mar. 1997.