메뉴 건너뛰기




Volumn , Issue , 2002, Pages 186-194

Tungsten-copper composites through coated powder approach

Author keywords

Chemical Coating; Physical Properties; Powder Metallurgy; Sintering

Indexed keywords

AGGREGATES; ATMOSPHERIC PRESSURE; COMPRESSIBILITY; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRIC CURRENTS; GRAIN SIZE AND SHAPE; HEAT LOSSES; POWDER COATINGS; POWDER METALLURGY; SCANNING ELECTRON MICROSCOPY; SINTERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TUNGSTEN;

EID: 2342427048     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (14)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.