Through-Mask Anodic Patterning of Copper Surfaces and Film Stability in Biological Media

Langmuir

Volumn 20, Issue 8, 2004, Pages 3483-3486

  Dai, Haixia ^a   Thai, Corrine K ^a   Sarikaya, Mehmet ^b   Baneyx, François ^a   Schwartz, Daniel T ^a  

^a UNIVERSITY OF WASHINGTON   (United States)

^b University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NEGATIVE IONS; RAMAN SPECTROSCOPY; SEMICONDUCTOR MATERIALS; SURFACE CHEMISTRY; THERMODYNAMICS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

COMBINATORIAL BIOLOGY TECHNIQUES; SURFACE PATTERNS;

COPPER;

ANIONS; COPPER; ESCA; RAMAN SPECTROSCOPY; THERMODYNAMICS; THIN FILMS; X RAY SPECTROSCOPY;

BUFFER; COPPER; HYDROXIDE; HYDROXIDE ION;

ARTICLE; BIOLOGICAL MODEL; CELL ADHESION; CHEMISTRY; CYTOLOGY; ELECTROCHEMISTRY; ESCHERICHIA COLI; RAMAN SPECTROMETRY; TEMPERATURE;

BUFFERS; CELL ADHESION; COPPER; ELECTROCHEMISTRY; ESCHERICHIA COLI; HYDROXIDES; MODELS, BIOLOGICAL; SPECTRUM ANALYSIS, RAMAN; TEMPERATURE;

EID: 2342418578     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la0350711     Document Type: Article

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