-
1
-
-
0031272771
-
Laser assisted machining: An overview
-
G. Chryssolouris, G. Anifantis, N.S. Karagiannis, "Laser assisted machining: An overview," J. Manuf Sci Eng, Vol. 119, pp. 766-769, 1997.
-
(1997)
J. Manuf Sci Eng
, vol.119
, pp. 766-769
-
-
Chryssolouris, G.1
Anifantis, G.2
Karagiannis, N.S.3
-
2
-
-
0024079424
-
Thick and thin film manufacturers find laser machining cost effective
-
September
-
T.K McDermott, J. Tillotson Jr., R. C. Phoenix, "Thick and Thin Film Manufacturers Find Laser Machining Cost Effective," Hybrid Circuit Technology Vol. 5, No. 9, September, 1988.
-
(1988)
Hybrid Circuit Technology
, vol.5
, Issue.9
-
-
McDermott, T.K.1
Tillotson Jr., J.2
Phoenix, R.C.3
-
4
-
-
0037621024
-
Laser cutting speeds for ceramic tile: A theoretical-empirical comparison
-
March
-
I Black, "Laser cutting speeds for ceramic tile: a theoretical-empirical comparison" OPT LASER TECHNOL, Vol. 30, No. 2, pp. 95-101, March 1998.
-
(1998)
Opt Laser Technol
, vol.30
, Issue.2
, pp. 95-101
-
-
Black, I.1
-
5
-
-
0001382143
-
Crack formation during laser cutting of silicon
-
January
-
Gross, T.S., Hening, S.D., and Watt, D.W. "Crack Formation During Laser Cutting of Silicon," J. Applied Phys., Vol. 69, No. 2, pp. 983-989, January 1991.
-
(1991)
J. Applied Phys.
, vol.69
, Issue.2
, pp. 983-989
-
-
Gross, T.S.1
Hening, S.D.2
Watt, D.W.3
-
6
-
-
0026471525
-
Fracture characteristics of an alumina oxide ceramic during continuous wave carbon dioxide laser cutting
-
R.Smith, N. Surprenant, and D.A. Kaminski, "Fracture Characteristics of an Alumina Oxide Ceramic During Continuous Wave Carbon Dioxide Laser Cutting," ICALEO, pp. 337-347, 1991.
-
(1991)
ICALEO
, pp. 337-347
-
-
Smith, R.1
Surprenant, N.2
Kaminski, D.A.3
-
7
-
-
0030079816
-
Investigation of the surface integrity of laser-cut ceramic
-
J.H. Zhang, T.C. Lee, X. Ai, and W.S. Lau, "Investigation of the Surface Integrity of Laser-Cut Ceramic," J. of Materials Processing Technology, Vol. 57, pp. 304-310, 1996.
-
(1996)
J. of Materials Processing Technology
, vol.57
, pp. 304-310
-
-
Zhang, J.H.1
Lee, T.C.2
Ai, X.3
Lau, W.S.4
-
8
-
-
0029411622
-
Plane stress model for fracture of ceramics during laser cutting
-
K.LI+, Plane stress model for fracture of ceramics during laser cutting, Int. J. Mach. Tools Manufacturing, Vol.35, No.11, pp.1493-1506, 1995.
-
(1995)
Int. J. Mach. Tools Manufacturing
, vol.35
, Issue.11
, pp. 1493-1506
-
-
Li, K.1
-
9
-
-
0026471525
-
Fracture characteristics of an aluminum oxide ceramic during continuous wave carbon dioxide laser cutting
-
R.N.Smith, Fracture characteristics of an aluminum oxide ceramic during continuous wave carbon dioxide laser cutting, ICALEO, pp337-347, 1991.
-
(1991)
ICALEO
, pp. 337-347
-
-
Smith, R.N.1
-
10
-
-
0000597601
-
Controlled separation of brittle materials using a laser
-
R.M.Lumley, Controlled separation of brittle materials using a laser, American Ceramic Society Bulletin, Vol. 48, pp.850-854, 1969.
-
(1969)
American Ceramic Society Bulletin
, vol.48
, pp. 850-854
-
-
Lumley, R.M.1
-
11
-
-
84885309303
-
-
Dicing of Micro-semiconductors, U.S. Patent No. 3,112,850
-
Garibotti, D. J., Dicing of Micro-semiconductors, U.S. Patent No. 3,112,850., 1963.
-
(1963)
-
-
Garibotti, D.J.1
-
12
-
-
0039353531
-
Pulsed laser processing of ceramics in water
-
Morita,N., Pulsed laser processing of ceramics in water, Applied Physics Letters., Vol.52, No.23, 1988.
-
(1988)
Applied Physics Letters
, vol.52
, Issue.23
-
-
Morita, N.1
-
14
-
-
0033349781
-
A study of laser cutting engineering ceramics
-
Lei Hong, A study of laser cutting engineering ceramics, Optics & Laser Technology, Vol.31, pp.531-538, 1999.
-
(1999)
Optics & Laser Technology
, vol.31
, pp. 531-538
-
-
Hong, L.1
-
15
-
-
84885328563
-
Fracture control of unsupported ceramics during laser machining using a simultaneous prescore
-
submitted to
-
A.E. Segall, G. Cai, R. Akarapu, A. Romasco, and B.Q.Li, 2004, "Fracture Control of Unsupported Ceramics during Laser Machining using a Simultaneous Prescore", submitted to J. Laser Application.
-
(2004)
J. Laser Application
-
-
Segall, A.E.1
Cai, G.2
Akarapu, R.3
Romasco, A.4
Li, B.Q.5
-
16
-
-
0038048134
-
Finite element modeling of ablation phenomena and thermal stress evolution during a unique application of dual laser cutting of ceramics
-
San Diego, CA, March
-
R. Akarapu, B.Q. Li, and A.E. Segall, "Finite Element Modeling of Ablation Phenomena and Thermal Stress Evolution During a Unique Application of Dual Laser Cutting of Ceramics," Proceedings of TMS Annual Conference, San Diego, CA, pp. 87-98, March 2003.
-
(2003)
Proceedings of TMS Annual Conference
, pp. 87-98
-
-
Akarapu, R.1
Li, B.Q.2
Segall, A.E.3
-
17
-
-
1842690983
-
A 3-D numerical model for ablation phenomena and thermal stress evolution during laser machining
-
HT2003-40298, Las Vegas, Nevada, July 21-23
-
R. Akarapu, B.Q. Li, and A.E. Segall, "A 3-D Numerical Model for Ablation Phenomena and Thermal Stress Evolution During Laser Machining," HT2003-40298, Proceedings of ASME Summer Heat Transfer Conference, Las Vegas, Nevada, July 21-23, 2003
-
(2003)
Proceedings of ASME Summer Heat Transfer Conference
-
-
Akarapu, R.1
Li, B.Q.2
Segall, A.E.3
-
18
-
-
0026139724
-
Enthalpy method for ablation-type moving boundary problems
-
W.Hunter and James R. Kuttler, 1991, "Enthalpy Method for Ablation-Type Moving Boundary Problems", J. Thermophysics, Vol. 5, No.2, pp. 240-242.
-
(1991)
J. Thermophysics
, vol.5
, Issue.2
, pp. 240-242
-
-
Hunter, W.1
Kuttler, J.R.2
-
19
-
-
1842657264
-
A finite element model for crystal plasticity during large deformation and comparison with experimental measurements
-
TMS-2002
-
R. Prasanna, B. Q. Li and D. P. Field, "A finite element model for crystal plasticity during large deformation and comparison with experimental measurements", Hot deformation, TMS-2002.
-
Hot Deformation
-
-
Prasanna, R.1
Li, B.Q.2
Field, D.P.3
|