Influence of the magnetic field and magnetoresistance on the electrodeposition of Ni nanocontacts in thin films and microwires

Journal of Magnetism and Magnetic Materials

Volumn 272-276, Issue III, 2004, Pages 2436-2438

  Nikolic, N D ^a   Wang, Hai ^a   Cheng, Hao ^a   Guerrero, C A ^a   Garcia, N ^a  

^a CSIC   (Spain)

Author keywords

Copper; Eletrodeposition; Magnetic field; Nanocontacts; Nickel

Indexed keywords

COPPER; DIFFUSION; ELECTRODEPOSITION; MAGNETIC FIELD EFFECTS; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; NATURAL FREQUENCIES; THERMAL EFFECTS; THIN FILMS;

FERRITE POWDER; LORENTZ FORCE; MICROWIRE GAPS; NANOCONTACTS;

NICKEL;

EID: 23044509984     PISSN: 03048853     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmmm.2003.12.1203     Document Type: Conference Paper

References (5)

1. J.C. Shannon, Z.H. Gu, T.Z. Fahidy, J. Electrochem. Soc. 144 (1997) L314.
2. O. Devos, A. Oliver, J.P. Chopart, O. Aaboubi, G. Maurin, J. Electrochem, Soc. 145 (1998) 401.
3. S. Bodea, L. Vignon, R. Ballou, P. Molho, Phys. Rev. Lett. 83 (1999) 2612.
4. K.M. Grant, J.W. Hemmert, H.S. White, J. Electroanal. Chem. 500 (2001) 95.
5. N. Garcia, M. Muñoz, G.G. Qian, H. Rohrer, I.G. Saveliev, Y.-W. Zhao, Appl. Phys. Lett. 79 (2001) 4550.