The effect of extrusion processing conditions on EVOH/ clay nanocomposites at low organo-clay contents

Polymer Composites

Volumn 26, Issue 3, 2005, Pages 343-351

  Artzi, N ^a   Tzur, A ^a   Narkis, M ^a   Siegmann, A ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CLAY; COMPRESSION MOLDING; COPOLYMERS; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; MORPHOLOGY; TORQUE;

COUNTER ROTATING; NANOMETER SCALE; POLYMER CHAINS; POLYMER MATRICES;

NANOSTRUCTURED MATERIALS;

EID: 23044466077     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.20096     Document Type: Article

References (15)

1. E. van Zyl Werner, G. Monserrat, A.G.S. Bernard, J.K. Bart, Th.M. De Hosson Jeff, H. Verweij, Macromol. Mater. Eng., 287, 106 (2002).
2. J.W. Cho and D.R. Paul, Polymer, 42, 1083 (2001).
3. P. Kodgire, R. Kalgaonkar, S. Hambir, N. Bulakh, and J.P. Jog, J. Appl. Polym. Sci., 81, 1786 (2001).
4. P. Svoboda, C. Zeng, H. Wang, L.J. Lee, and D.L. Tomasko, J. Appl. Polym. Sci., 85, 1562 (2002).
5. J. Omachinski, S. Qian, L. Tie, W.W. Timothy, and S.S. Walter, 60th ANTEC, 1, 214, 2002.
6. C. Ling, W. Shing-Chang, and P. Sreekumar, J. Appl. Polym. Sci., 88, 3298 (2003).
7. N. Artzi, Y. Nir, D. Wang, M. Narkis, and A. Siegmann, Polym. Comp., 22, 710 (2001).
8. N. Artzi, Y. Nir, M. Narkis, and A. Siegmann, J. Polym. Sci., Part B: Polym. Phys., 40, 1741 (2002).
9. N. Artzi, Y. Nir, M. Narkis, and A. Siegmann, Polym. Comp., 24, 627 (2003).
10. T.S. Ellis, Polymer, 44, 6443 (2003).
11. T.D. Fornes, P.J. Yoon, H. Keskkula, and D.R. Paul, Polymer, 42, 9929 (2001).
12. G. Galgali, C. Ramesh, and A. Lele, Macromolecules, 34, 852 (2001).
13. T.D. Fornes and D.R. Paul, Polymer, 44, 3945 (2003).
14. Y. Nir, "Structure and Properties Characterization of EVOH/ Copolyamide 616.9 Blends," Ph.D. Thesis, Technion-IIT, Department of Chemical Engineering, Haifa, Israel (1996).
15. J.M. Lagaron, E. Giménez, and J.J. Saura, Polym. Int., 50, 635 (2001).