Spin-on Cu films for ultralarge scale integrated metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2321-2324

  Murakami, Hirohiko ^a  

^a ULVAC INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22844454684     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590911     Document Type: Article

References (7)

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7. D. Edelstein et al. Tech. Dig. Int. Electron Devices Meet. 773 (1997).