Surface treatment of pure and alloyed aluminum using a new plasma-based ion implanter apparatus

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 2, 1999, Pages 859-862

  Popovici, D ^a  

^a INRS EMT   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22644452559     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590651     Document Type: Article

References (10)

1. Proceedings of the International Workshops on Plasma-Based Ion Implantation, Surf, Coat. Technol. 85 (1996); 93 (1997).
2. J. R. Conrad, J. L. Radtke, R. A. Dodd, F. J. Worzala, and N. C. Tran, J. Appl. Phys. 62, 4591 (1987).
3. A. H. Sarkissian, A. Bourque-Viens, R. W. Paynter, R. G. Saint-Jacques, and B. L. Stansfield; Surf. Coat. Technol. 98, 1336 (1998).
4. See, for example, R. J. Bourcier, S. M. Myers, and D. H. Polonis, Nucl. Instrum. Methods Phys. Res. B 44, 278 (1990).
5. G. G. Ross, L. Leblanc, B. Terreault, J. F. Pageau, and P. A. Collier, Nucl. Instrum. Methods Phys. Res. B 66, 17 (1992).
6. L. E. Davis, N. C. MacDonald, P. W. Palmberg, G. E. Riach, and R. E. Weber, Handbook of Auger Electron Spectroscopy (Perkin-Elmer, Eden Prairie, MN, 1978).
7. J. F. Ziegler, J. P. Biersack, and U. Littmark, The Stopping and Range of Ions in Matter (Pergamon, New York, 1985), Vol. 1.
8. For a recent paper containing many earlier references, see K. W. McElhaney, J. J. Vlasak, and W. D. Nix, J. Mater. Res. 13, 1300 (1998).
9. S. Ohira and M. Iwaki, Mater. Sci. Eng. 90, 143 (1987).
10. W. Ekstein, C. Garcia-Rosales, J. Roth, and W. Ottenberger, Sputtering Data, MPI für Plasmaphysik Report No. IPP 9/82, Garching, Germany, February 1993.