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Volumn 25, Issue 3, 1999, Pages 471-

Coverage simulation for non-liner surface reaction

Author keywords

CVD; Non linear surface reaction; Step hole coverage; Tungsten

Indexed keywords


EID: 22644451445     PISSN: 0386216X     EISSN: None     Source Type: Journal    
DOI: 10.1252/kakoronbunshu.25.466     Document Type: Article
Times cited : (2)

References (10)
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  • 2
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    • Bleck, I.A.1    Vander Plas, H.A.2
  • 4
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    • Prediction of step coverage during blanket CVD tungsten deposition in cylindrical pores
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    • (1990) J. Electrochem. Soc. , vol.137 , pp. 328-335
    • Chatterjee, S.1    McConica, C.M.2
  • 5
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    • Simulation of rare gas transport and profile evolution in nonplanar substrate chemical vapor deposition
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  • 6
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    • A model with surface reaction and gas transport for tungsten CVD
    • Tokyo, Japan
    • Hayakawa, K., M. Kimura and Y. Chiba ; "A Model with Surface Reaction and Gas Transport for Tungsten CVD," Conf. Proc. ULSI XI, p. 497-503, Tokyo, Japan (1996)
    • (1996) Conf. Proc. ULSI XI , pp. 497-503
    • Hayakawa, K.1    Kimura, M.2    Chiba, Y.3
  • 7
    • 0024755516 scopus 로고
    • Deposition profile simulation using the direct simulation Monte Carlo method
    • Ikegawa, M. and J. Kobayashi ; "Deposition Profile Simulation Using the Direct Simulation Monte Carlo Method," J. Electorochem. Soc., 136, 2982-2986 (1989)
    • (1989) J. Electorochem. Soc. , vol.136 , pp. 2982-2986
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  • 9
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    • Plasma-deposited thin-film step coverage calculated by computer simulation
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    • Ross, R.C.1    Vossen, J.L.2
  • 10
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    • A two-dimensional step coverage boundary element model with consideration of moving deposition fronts
    • Tsai, C. Y. and S. B. Dseu ; "A Two-Dimensional Step Coverage Boundary Element Model with Consideration of Moving Deposition Fronts," J. Electrochem. Soc., 140, 2128-2133 (1993)
    • (1993) J. Electrochem. Soc. , vol.140 , pp. 2128-2133
    • Tsai, C.Y.1    Dseu, S.B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.