Micromachining using ultrasonic impact grinding

Journal of Micromechanics and Microengineering

Volumn 15, Issue 8, 2005, Pages 1556-1559

  Medis, Praveen S ^a   Henderson, H Thurman ^a  

^a UNIVERSITY OF CINCINNATI   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC PRODUCTS; ETCHING; GRINDING (MACHINING); LASER ABLATION; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTOR MATERIALS; SILICON; ULTRASONIC EQUIPMENT;

ANISOTROPIC ETCHING; DEEP RESERVOIRS; SOFT MATERIALS; ULTRASONIC IMPACT GRINDING (UIG);

MICROMACHINING;

EID: 22544447724     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/8/025     Document Type: Article

References (5)

1. Rennhack E H 1973 Preparation of electron microscope disk specimens by ultrasonic impact grinding Rev. Sci. Instrum. 44 655-6
2. Ya G, Qin H W, Yang S C and Xu Y W 2002 Analysis of the rotary ultrasonic machining mechanism J Mater. Process. Technol. 129 182-5
3. Sergent J E 1971 An investigation of double injection in semi-insulators with injection dependent carrier lifetimes in the presence of electron trapping, using neutron-irradiated silicon as a case in point PhD Dissertation University of Cincinnati, OH A1-A4
4. 3 waveguides Appl. Phys. Lett. 31 263-5
5. Bertolini A, Beverini N, Dal Lago G, De Salvo R, Fidecaro F, Francesconi F, Francesconi M and Omiccioli G 5-axis CNC ultrasonic cutting machine: design and preliminary test unpublished CalTec LIGO project paper, LIGO-T020198-00-R