A parametrized three-dimensional model for MEMS thermal shear-stress sensors

Journal of Microelectromechanical Systems

Volumn 14, Issue 3, 2005, Pages 625-633

  Lin, Qiao ^a   Xu, Yong ^b   Jiang, Fukang ^c   Tai, Yu Chong ^d   Ho, Chih Ming ^e  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b Wayne State University   (United States)

^c Umachines Inc   (United States)

^d California Institute of Technology   (United States)

^e UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; HEAT CONDUCTION; HEAT TRANSFER; MATHEMATICAL MODELS; MICROSENSORS; SHEAR STRESS; THERMAL EFFECTS; THIN FILMS; THREE DIMENSIONAL;

MEMS SENSORS; THREE DIMENSIONAL MODEL;

MICROELECTROMECHANICAL DEVICES;

EID: 22444440731     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.844770     Document Type: Article

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