Adhesion promotion of Cu on C by Cr intermediate layers investigated by the SIMS method

Analytical and Bioanalytical Chemistry

Volumn 374, Issue 4, 2002, Pages 602-607

  Mayerhofer, Karl E ^a   Neubauer, Erich ^a,b   Eisenmenger Sittner, Christoph ^a   Hutter, Herbert ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b ARC SEIBERSDORF RESEARCH GMBH   (Austria)

Author keywords

Adhesion; Deposition; Diffusion; PVD; SIMS

Indexed keywords

ADHESION; CARBON; COPPER; FABRICATION; HEAT SINKS; HOT PRESSING; MAGNETRON SPUTTERING; MASS SPECTROMETRY; THERMAL CONDUCTIVITY;

INTERMEDIATE LAYERS;

COMPOSITE MATERIALS;

CARBON; CHROMIUM; COPPER;

ADHESION; CONFERENCE PAPER; ELECTRONICS; HEAT; MASS SPECTROMETRY; MICROWAVE OVEN; THERMAL ANALYSIS; THERMAL CONDUCTIVITY; VACUUM;

EID: 2242432607     PISSN: 16182642     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00216-002-1540-3     Document Type: Conference Paper

References (8)

1. Mortimer DA, Nicholas M (1970) J Mat Sci 5:149-155
2. Mortimer DA, Nicholas M (1973) J Mat Sci 8:640-648
3. Voitovitch R, Mortensen A, Hodaj F, Eustathopoulos N (1999) Acta Materialia 47(4):1117-1128
4. Landolt-Börnstein (eds) (1999) Numerical Data and Fundamental Relationships in Science and Technology, 6th Run, vol IV/2b. Springer, Berlin Heidelberg New York, p 686
5. Abel PB, Korenyi-Both AL, Honecy FS, Pepper SV (1994) J Mat Res 9(3):617-624
6. SRIM-2000.39. (c) http://www.srim.org. Cited 17 February 2002
7. Eisenmenger-Sittner C, Hutter H (2000) Microchim Acta 133: 267-271
8. Mayerhofer K, Neubauer E, Eisenmenger C, Hutter H (2001) Appl Surf Sci 179:275-280