Development of a low-temperature electro-mechanical testing device

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 2 PART III, 2005, Pages 3620-3623

  Mbaruku, A L ^a   Trociewitz, U P ^b   Schwartz, J ^a  

^a FAMU FSU COLLEGE OF ENGINEERING   (United States)

^b FLORIDA STATE UNIVERSITY   (United States)

Author keywords

Mechanical factors; Strain measurement; Superconducting materials; Test equipment; Test facility

Indexed keywords

CRACK PROPAGATION; CRITICAL CURRENTS; ELECTRIC POTENTIAL; HIGH TEMPERATURE SUPERCONDUCTORS; STRAIN; STRAIN MEASUREMENT; TENSILE TESTING; TEST FACILITIES; THERMAL CYCLING;

FATIGUE CYCLES; LORENTZ FORCE; MECHANICAL FACTORS; TEST EQUIPMENT;

LOW TEMPERATURE TESTING;

EID: 22144450282     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.849374     Document Type: Conference Paper

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