Cu ion plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and the RHQT-processed Nb3Al conductors

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 2 PART III, 2005, Pages 3376-3379

  Kikuchi, Akihiro ^a   Sakurai, Yoshihiro ^b   Tagawa, Kohei ^b   Takeuchi, Takao ^a   Kitaguchi, Hitoshi ^a   Iijima, Yasuo ^a   Banno, Nobuya ^a   Inoue, Kiyoshi ^c  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b HITACHI CABLE LTD   (Japan)

^c UNIVERSITY OF TOKUSHIMA   (Japan)

Author keywords

Bending; Cu ion plating; Cu stabilizer; Recovery current; Reel to reel apparatus; RHQT processed Nb3Al wire; V I characteristic

Indexed keywords

BENDING (DEFORMATION); COPPER; CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC CONDUCTORS; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; HEATING; IONS; NIOBIUM COMPOUNDS; QUENCHING; STABILIZERS (AGENTS); WIRE;

BENDING; CU ION-PLATING; CU STABILIZERS; RECOVERY CURRENTS; REEL TO REEL APPARATUS; RHQT-PROCESSES NB3AL WIRE; V-I CHARACTERISTICS;

COPPER PLATING;

EID: 22044448934     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.848911     Document Type: Conference Paper

References (4)

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3. 3Al superconductors," Supercond. Sci. Technol., vol. 16, pp. 1173-1181, 2003.
4. M. N. Wilson, Superconducting Magnets, R. G. Scurlock, Ed. Oxford: Oxford University Press, 1983, pp. 91-92.