Six-layer process for the fabrication of Nb/Al -A1Ox/Nb Josephson junction devices

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 2 PART I, 2005, Pages 82-85

  Cantor, Robin ^a   Hall, John ^a  

^a STAR Cryoelectronics LLC   (United States)

Author keywords

Josephson device fabrication; SQUIDs

Indexed keywords

ALUMINUM COMPOUNDS; CURRENT DENSITY; DIELECTRIC FILMS; ELECTRIC FIELDS; FABRICATION; IRON; NIOBIUM; REACTIVE ION ETCHING; SILICON WAFERS; SQUIDS; TUNNEL JUNCTIONS;

JOSEPHSON DEVICE FABRICATION; PLANAR GRADIOMETERS; TRILAYER FILMS; VACUUM CHAMBERS;

JOSEPHSON JUNCTION DEVICES;

EID: 22044447241     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.849699     Document Type: Conference Paper

References (6)

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5. A. T. Barfknecht, R. C. Ruby, and H. Ko, "A simple and robust niobium Josephson junction integrated circuit process," IEEE Trans. Magn., vol. MAG-27, pp. 3125-3128, Mar. 1991.
6. R. Cantor and J. Hall, patent pending.