Packaging methods and techniques for MOEMS and MEMS

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5716, Issue , 2005, Pages 9-18

  Farrens, Shari ^a  

^a EV GROUP   (Austria)

Author keywords

Chip to wafer packaging; Face to face alignment; Low temperature bonding; MOEMS and MEMS bonding packaging; Wafer bonding; Wafer level packaging

Indexed keywords

HETEROJUNCTIONS; MICROELECTROMECHANICAL DEVICES; MICROOPTICS; MICROPROCESSOR CHIPS; NANOTECHNOLOGY; NETWORKS (CIRCUITS); PLASTICS; SUBSTRATES;

CHIP TO WAFER PACKAGING; FACE-TO-FACE ALIGNMENT; LOW TEMPERATURE BONDING; MOEMS AND MEMS BONDING/PACKAGING; WAFER BONDING; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 21844440020     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.597044     Document Type: Conference Paper

References (11)

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