Three-dimensional transient finite element analysis for microstructure formation and residual stresses in laser-aided DMD process

Proceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference 2004, HT/FED 2004

Volumn 3, Issue , 2004, Pages 969-978

  Ghosh, S ^a   Choi, J ^a  

^a Architectural and Environmental Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DEFECTS; DEPOSITION; FINITE ELEMENT METHOD; MICROSTRUCTURE; PHASE TRANSITIONS; POISSON RATIO; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; STRUCTURAL LOADS; THERMAL STRESS;

COMPLEX FLUID FLOW; LASER-AIDED DIRECT MATERIAL DEPOSITION (DMD); MATALLO-THERMO-MECHANICAL-COUPLING; MICRO-DEFECTS;

LASER APPLICATIONS;

EID: 21644482153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ht-fed2004-56359     Document Type: Conference Paper

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